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From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org
Subject: [PATCH 0/19] v6 multi-die/package topology support
Date: Mon, 13 May 2019 13:58:44 -0400	[thread overview]
Message-ID: <20190513175903.8735-1-lenb@kernel.org> (raw)


This patch series does 4 things.

1. Parse the new CPUID.1F leaf to discover multi-die/package topology

2. Export multi-die topology inside the kernel

3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know
   the difference between die and package-scope MSR.

4. Export multi-die topology to user-space via sysfs

These changes should have no impact on cache topology,
NUMA topology, Linux scheduler, or system performance.

These topology changes primarily impact parts of the kernel
and some applications that care about package MSR scope.
Also, some software is licensed per package, and other tools,
such as benchmark reporting software sometimes cares about packages.

Changes since v5:
	
	The patch numbers have decremented by 3, since the first 3 patches
	in the original series are now upstream.

	The last two "Cosmetic rename" patches have been replaced with
	those by Kan, who did a more thorough variable rename than I had
	originally proposed.


	[PATCH 18/19] perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support
	[PATCH 19/19] perf/x86/intel/rapl: Cosmetic rename internal variables in response to multi-die/pkg support

I'm not aware of any outstanding feedback on this series,
functional or cosmetic.

thanks,
Len Brown, Intel Opensource Technology Center

--------------
The following changes since commit a13f0655503a4a89df67fdc7cac6a7810795d4b3:

  Merge tag 'iommu-updates-v5.2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/joro/iommu (2019-05-13 09:23:18 -0400)

are available in the Git repository at:

  git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux.git x86

for you to fetch changes up to 0ddb97e121397d37933233da303556141814fa47:

  perf/x86/intel/rapl: Cosmetic rename internal variables in response to multi-die/pkg support (2019-05-13 13:41:50 -0400)

----------------------------------------------------------------
Kan Liang (5):
      perf/x86/intel/uncore: Support multi-die/package
      perf/x86/intel/rapl: Support multi-die/package
      perf/x86/intel/cstate: Support multi-die/package
      perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support
      perf/x86/intel/rapl: Cosmetic rename internal variables in response to multi-die/pkg support

Len Brown (9):
      x86 topology: Add CPUID.1F multi-die/package support
      x86 topology: Create topology_max_die_per_package()
      cpu topology: Export die_id
      x86 topology: Define topology_die_id()
      x86 topology: Define topology_logical_die_id()
      topology: Create package_cpus sysfs attribute
      topology: Create core_cpus and die_cpus sysfs attributes
      thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages
      hwmon/coretemp: Cosmetic: Rename internal variables to zones from packages

Zhang Rui (5):
      powercap/intel_rapl: Simplify rapl_find_package()
      powercap/intel_rapl: Support multi-die/package
      thermal/x86_pkg_temp_thermal: Support multi-die/package
      powercap/intel_rapl: Update RAPL domain name and debug messages
      hwmon/coretemp: Support multi-die/package

 Documentation/cputopology.txt                |  48 ++++++---
 Documentation/x86/topology.rst               |   4 +
 arch/x86/events/intel/cstate.c               |  14 ++-
 arch/x86/events/intel/rapl.c                 |  20 ++--
 arch/x86/events/intel/uncore.c               |  80 +++++++--------
 arch/x86/events/intel/uncore.h               |   4 +-
 arch/x86/events/intel/uncore_snbep.c         |   4 +-
 arch/x86/include/asm/processor.h             |   4 +-
 arch/x86/include/asm/smp.h                   |   1 +
 arch/x86/include/asm/topology.h              |  17 ++++
 arch/x86/kernel/cpu/common.c                 |   1 +
 arch/x86/kernel/cpu/topology.c               |  88 +++++++++++++----
 arch/x86/kernel/smpboot.c                    |  69 +++++++++++++
 arch/x86/xen/smp_pv.c                        |   1 +
 drivers/base/topology.c                      |  22 +++++
 drivers/hwmon/coretemp.c                     |  36 +++----
 drivers/powercap/intel_rapl.c                |  75 +++++++-------
 drivers/thermal/intel/x86_pkg_temp_thermal.c | 142 ++++++++++++++-------------
 include/linux/topology.h                     |   6 ++
 19 files changed, 422 insertions(+), 214 deletions(-)



             reply	other threads:[~2019-05-13 17:59 UTC|newest]

Thread overview: 38+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2019-05-13 17:58 Len Brown [this message]
2019-05-15  8:55 ` Peter Zijlstra
2019-05-15 16:38   ` Ingo Molnar
2019-05-22 20:44 ` Ingo Molnar
2019-05-13 17:58 [PATCH 01/19] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-05-13 17:58 ` [PATCH 03/19] cpu topology: Export die_id Len Brown
2019-05-23  9:24   ` [tip:x86/topology] cpu/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 04/19] x86 topology: Define topology_die_id() Len Brown
2019-05-23  9:24   ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 05/19] x86 topology: Define topology_logical_die_id() Len Brown
2019-05-23  9:25   ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 06/19] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-05-23  9:26   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 07/19] powercap/intel_rapl: Support multi-die/package Len Brown
2019-05-23  9:26   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 08/19] thermal/x86_pkg_temp_thermal: " Len Brown
2019-05-23  9:27   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 09/19] powercap/intel_rapl: Update RAPL domain name and debug messages Len Brown
2019-05-23  9:28   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 10/19] hwmon/coretemp: Support multi-die/package Len Brown
2019-05-23  9:29   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 11/19] topology: Create package_cpus sysfs attribute Len Brown
2019-05-23  9:29   ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 12/19] topology: Create core_cpus and die_cpus sysfs attributes Len Brown
2019-05-23  9:30   ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 13/19] perf/x86/intel/uncore: Support multi-die/package Len Brown
2019-05-23  9:31   ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:58 ` [PATCH 14/19] perf/x86/intel/rapl: " Len Brown
2019-05-23  9:31   ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:58 ` [PATCH 15/19] perf/x86/intel/cstate: " Len Brown
2019-05-23  9:32   ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:59 ` [PATCH 16/19] thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages Len Brown
2019-05-23  9:33   ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:59 ` [PATCH 17/19] hwmon/coretemp: " Len Brown
2019-05-23  9:34   ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:59 ` [PATCH 18/19] perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support Len Brown
2019-05-23  9:34   ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:59 ` [PATCH 19/19] perf/x86/intel/rapl: Cosmetic rename internal variables " Len Brown
2019-05-23  9:35   ` [tip:x86/topology] " tip-bot for Kan Liang

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