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From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
	Len Brown <len.brown@intel.com>
Subject: [PATCH 08/19] thermal/x86_pkg_temp_thermal: Support multi-die/package
Date: Mon, 13 May 2019 13:58:52 -0400	[thread overview]
Message-ID: <281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com> (raw)
In-Reply-To: <7b23d2d26d717b8e14ba137c94b70943f1ae4b5c.1557769318.git.len.brown@intel.com>

From: Zhang Rui <rui.zhang@intel.com>

Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can
expose multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
---
 drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 ++++----
 1 file changed, 4 insertions(+), 4 deletions(-)

diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..405b3858900a 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
  */
 static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 
 	if (pkgid >= 0 && pkgid < max_packages)
 		return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
 
 static int pkg_temp_thermal_device_add(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 	u32 tj_max, eax, ebx, ecx, edx;
 	struct pkg_device *pkgdev;
 	int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
 	 * worker will see the package anymore.
 	 */
 	if (lastcpu) {
-		packages[topology_logical_package_id(cpu)] = NULL;
+		packages[topology_logical_die_id(cpu)] = NULL;
 		/* After this point nothing touches the MSR anymore. */
 		wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
 		      pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
 	if (!x86_match_cpu(pkg_temp_thermal_ids))
 		return -ENODEV;
 
-	max_packages = topology_max_packages();
+	max_packages = topology_max_packages() * topology_max_die_per_package();
 	packages = kcalloc(max_packages, sizeof(struct pkg_device *),
 			   GFP_KERNEL);
 	if (!packages)
-- 
2.18.0-rc0


  parent reply	other threads:[~2019-05-13 18:00 UTC|newest]

Thread overview: 38+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2019-05-13 17:58 [PATCH 01/19] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-05-13 17:58 ` [PATCH 03/19] cpu topology: Export die_id Len Brown
2019-05-23  9:24   ` [tip:x86/topology] cpu/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 04/19] x86 topology: Define topology_die_id() Len Brown
2019-05-23  9:24   ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 05/19] x86 topology: Define topology_logical_die_id() Len Brown
2019-05-23  9:25   ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 06/19] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-05-23  9:26   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 07/19] powercap/intel_rapl: Support multi-die/package Len Brown
2019-05-23  9:26   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` Len Brown [this message]
2019-05-23  9:27   ` [tip:x86/topology] thermal/x86_pkg_temp_thermal: " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 09/19] powercap/intel_rapl: Update RAPL domain name and debug messages Len Brown
2019-05-23  9:28   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 10/19] hwmon/coretemp: Support multi-die/package Len Brown
2019-05-23  9:29   ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 11/19] topology: Create package_cpus sysfs attribute Len Brown
2019-05-23  9:29   ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 12/19] topology: Create core_cpus and die_cpus sysfs attributes Len Brown
2019-05-23  9:30   ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 13/19] perf/x86/intel/uncore: Support multi-die/package Len Brown
2019-05-23  9:31   ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:58 ` [PATCH 14/19] perf/x86/intel/rapl: " Len Brown
2019-05-23  9:31   ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:58 ` [PATCH 15/19] perf/x86/intel/cstate: " Len Brown
2019-05-23  9:32   ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:59 ` [PATCH 16/19] thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages Len Brown
2019-05-23  9:33   ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:59 ` [PATCH 17/19] hwmon/coretemp: " Len Brown
2019-05-23  9:34   ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:59 ` [PATCH 18/19] perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support Len Brown
2019-05-23  9:34   ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:59 ` [PATCH 19/19] perf/x86/intel/rapl: Cosmetic rename internal variables " Len Brown
2019-05-23  9:35   ` [tip:x86/topology] " tip-bot for Kan Liang
  -- strict thread matches above, loose matches on Subject: below --
2019-05-13 17:58 [PATCH 0/19] v6 multi-die/package topology support Len Brown
2019-05-15  8:55 ` Peter Zijlstra
2019-05-15 16:38   ` Ingo Molnar
2019-05-22 20:44 ` Ingo Molnar

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